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Hitachi

Hitachi High-Technologies GLOBAL

9000 Series

Next generation devices at 20nm and below require double-patterning, 3D (three-dimensional) structures, and complex, high-precision processes that include protective layer formation and finishing techniques for new materials. Hitachi High-Tech developed the Conductor Etch System 9000 Series to support these next-generation processes.

Features

  1. The new HHT 9000 platform utilizes Hitachi’s proprietary low-contaminant, high-speed transfer system for high productivity.
    The linked common platform permits process flexibility and future expansion through its modular chamber design.
  2. Platform and user interface standardization will facilitate a smooth transition to 450-mm wafer sizes.
  3. The 9000 platform incorporates HHT’s new microwave ECR(Electron Cyclotron Resonance) plasma etching chamber that is proven in high volume manufacturing usage.

Specification

Applicable wafer diameter 300mm
System configuration 9 chambers (max.)
*
These photographs are partially different from actual systems.

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