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Next generation memories such as FeRAM (Ferroelectric Random Access Memory), ReRAM (Resistance Random Access Memory) and MRAM (Magnetoresistive Random Access Memory) require etching of novel non-volatile materials.
However, by-product adhesion inside of etch chamber causes significant productivity loss in volume production.
Non-Volatile Materials Etch System E-600/8000 Series: the EMCP (Electro Magnetically Coupled Plasma) offers an outstanding solution to this problem ensuring constant high performance even for non-volatile material etch.
|Applicable wafer diameter||200mm, 300mm|
|System configuration||2 etch+ 2 ash (max.)|