Skip to main content
The space-saving and lightweight TM3030 can be conveniently installed on a tabletop*. No cooling water is needed, so installation is quick and easy and requires only a standard 100-240 V AC power supply.
Imaging with the TM3030 couldn’t be simpler. Pressing the “Start” button automatically turns on the beam, adjusts focus, brightness and contrast, as well as displays the image at an easy-to-view starting magnification of x100.
When a non-conductive sample is observed with a high-vacuum SEM, electrons accumulate on the specimen surface causes charge-up, preventing imaging. In order to avoid the charge-up damage, the sample is usually coated with a thin layer of metal prior to observation. This process is not only time-consuming, but also interferes with optical imaging of surface details as well as EDX analysis. The TM3030 overcomes this problem with “charge-up reduction mode.” This mode uses low-vacuum functionality to dissipate the charge.
By utilizing a low vacuum level inside the specimen chamber, more gas molecules are present. These gas molecules "G" can collide with the electron beam to generate positive ions "+" and electrons "e". Each positive ion "+" can be neutralized by one of the excess electrons "-" on the specimen surface. In this way the excess electrons on the surface of the sample are removed and the charge-up effect is eliminated or reduced.
The 5 kV accelerating voltage allows observation of surface details. It offers not only traditional topographic imaging, but also compositional imaging information. The 5 kV observation condition is further enhanced throughout high magnifications by improving the electron optics.
These functions will be utilized to enhance image quality at any observation condition modes and will be very effective for high-magnification specimens.
The TM3030Plus is equipped with a premium secondary electron detector and a backscattered electron detector which have been incorporated in FE-SEM or VP-SEM. Note: The TM3030 has a backscattered electron detector only.
These detectors can be operated effectively under low-vacuum conditions and can conduct both SE and BSE image observation without metal coating.
Both the TM3030 and TM3030Plus feature a BSE detector with 4 independent segments. By adding or subtracting signals from segments in different combinations, it is possible to emphasize compositional or topographic details in the image, as well as to produce shadowed images which highlight the sample from a particular direction.
Optional 3D-View software can generate three-dimensional views of the sample without sample tilting and/or alignment. It uses the 4 directional surface profiles from the signals acquired with each segment of the 4-segment backscattered electron detector.
The large specimen stage allows the mounting of a specimen up to 70mm in diameter and 50mm thick.
XY specimen motion 35mm.
Specimen: Ink printed (Uncoated)
SE, 5 kV, Charge-up reduction mode,
Magnification: ×1.0 K
TM3030Plus has a premium SE detector which has been incorporated in FE-SEM or VP SEM, and well-accepted by users as a high-sensitivity detector. It can be operated effectively under a low-vacuum environment and allows for quick SE image observation without specimen preparation.
The TM3030Plus allows for effective image analysis with dual signals in one image; displayed as one combined SE signal providing surface rich information and BSE signal for compositional information.
5 kV, Standard mode,
Magnification: ×1.0 K
The Energy Dispersive X-ray Spectrometer (EDX) for the Hitachi TM3030 series is equipped with the latest SDD (silicon drift detector), a large detection area (30 mm2), and multiple elemental analyses such as point/area analysis, line scan and mapping.
Uncoated sample observation brings seamless operation for the two signals through element mapping.
15 kV, Standard mode,
Magnification: ×3.0 K
A larger detection area allows less beam damage, lowering electron beam drift and charge-up reduction, and makes it possible to conduct observation for uncoated specimen.
|Magnification||×15 to ×60,000 (Up to ×240,000 with digital zoom)|
|Observation condition||5kV / 15kV / EDX|
|Observation mode||Standard mode
Charge-up reduction mode
|BSE:Conductor / Standard / Charge-up Reduction
SE:Standard / Charge-up Reduction
Mix:Standard / Charge-up Reduction
|Image mode||COMPO / Shadow 1 / Shadow 2 / TOPO|
|Sample stage traverse||X：±17.5mm、Y：±17.5mm|
|Maximum sample size||70 mm in diameter|
|Maximum sample height||50 mm|
|Electron gun||Pre-centered cartridge filament|
|Signal detection system||High-sensitivity semiconductor
4-segment BSE detector
|BSE:High-Sensitivity semiconductor 4-segment BSE detector
SE: High-Sensitivity Low Vacuum SE detector
|Auto image adjustment function||Auto start, Auto focus, Auto brightness/contrast|
|Frame memory||640 × 480 pixels, 1,280 × 960 pixels|
|Image data memory||HDD of PC and other removal media|
|Image format||BMP, TIFF, JPEG|
|Data display||Micron marker, micron value, date and time, image number and comments, Image mode, Observation condition, D* (Distance), Observation mode|
|Evacuation system (vacuum pump)||Turbomolecular pump: 30 L /s × 1 unit,
Diaphragm pump: 1 m3/h × 1 unit
|Operation help functions||Raster rotation, Magnification preset (two steps)
Image shift (±50 µm@D*=4.5 mm)
|Safety device||Over-current protection function, built-in ELCB|
|OS||Windows® 7 Professional (64bit version)|
|CPU||Intel® CoreTM i5-2520M (Equivalent or higher)|
|Memory size||2 GB minimum|
|Display monitor||1,280 × 800 pixels or 1,368 × 768 pixels|
|Display size||15-inch display|
|Interface connector||Installing USB 2.0 / 3.0 and PC-card slot
(IEEE1394 (6pin) for Oxford EDX is indispensable.)
|Memory device||With HDD DVD-ROM Drive|
|Other||More than 100MB of free space in HDD is required|
|Main unit||330 (W) × 606 (D) × 565 (H) mm, 63.0 kg (manual stage)
330 (W) × 633 (D) × 565 (H) mm, 66.0 kg (motor drive stage)
|330 (W) × 606 (D) × 565 (H) mm, 65.0 kg (manual stage)
330 (W) × 633 (D) × 565 (H) mm, 68.0 kg (motor drive stage)
|Diaphragm pump||145 × 256 × 217 mm, 4.5 kg|
|Room temperature||15 to 30°C (Δt=±2.5°C/h or less)|
|Power source (TM3030)||Single-phase AC100 to 240 V
(Minimum: 90 V, Maximum: 250 V)
|Grounding||100 ohm or less|
(Manufactured exclusively for Hitachi High-Technologies corporation by Bruker Nano GmbH)
(Manufactured for Hitachi High-Technologies Corporation by Oxford Instruments Analytical Ltd.)
When a filament is blown, changing the filament is rather easy. Remove the filament from the Wehnelt cap and simply attach a new filament assembly. Since the new filament is pre-centered at our factory, no adjustment is necessary. After attaching the filament assembly to the electron gun, it will be necessary to align the beam according to the on-board instructions for beam alignment.
Pre-centered cartridge filament
Mechanical axis adjustment GUI