Skip to main content

Hitachi

Hitachi High-Technologies in Singapore

Ion Milling System ArBlade 5000

The most advanced broad ion beam system for producing exceptionally high-quality cross-section or flat-milling samples for electron microscopy.

Features

Cross-section milling rate: 1 mm/hour!*1

The ArBlade 5000 is equipped with a fast-milling Ar ion gun with a milling rate twice as high for cutting-edge performance, thus dramatically reducing the processing time for cross-section preparation.

*1
Si protrudes 100 um from the mask edge.

Comparison of cross-section milling

(Specimen: lead for mechanical pencil, Milling time : 1.5 hours)

IM4000PLUS
IM4000PLUS

ArBlade 5000
ArBlade 5000

Cross-section widths up to 8 mm!

For large-area milling requirements such as electronic-device applications, a revolutionary cross-section milling holder design has been developed for wider-area fabrication.

Example of wide-area cross-section milling

(Specimen: electronic component, Milling time: 5 hours)

Enlarged of the red frame
Enlarged of the red frame

Enlarged of the left image
Enlarged of the left image

Hybrid Model: Dual-Milling Configuration Available

The all new ion-milling system is equipped with both cross-section milling and flat milling modes for the most complex application needs.
Equipped with multiple holders, the ArBlade 5000 system accommodates a wide range of applications.

Cross-section Milling

Used to produce wider, undistorted cross sections without applying mechanical stress to the sample

Flat Milling

Used for removing surface layer artifacts and final polish after traditional mechanical polishing techniques.

Image of Cross-section Milling
Image of Cross-section Milling

Image of Flat Milling
Image of Flat Milling

Specification

Specification
Discription
Gas used Ar(argon) gas
Accelerating voltage 0 to 8 kV
Cross-section Milling
Maximum milling rate(Material: Si) ≥ 1 mm/hr*1
Maximum milling width 8 mm (with using a wide-area cross-sectional milling holder)
Maximum sample size 20(W) × 12(D) × 7(H) mm
Sample moving range X ±7 mm, Y 0 to +3 mm
Ion beam intermittent irradiation Standard function
Swing angle ±15°, ±30°, ±40°
Flat Milling
Milling area φ32 mm
Maximum sample size φ50 × 25(H) mm
Sample moving range X 0 to +5 mm
Ion beam intermittent irradiation Standard function
Rotation speed 1 r/m, 25 r/m
Tile 0 to 90°
*1
Si protrudes 100 µm from the mask edge.

Optional

Optional
ItemDiscription
Higher beam tolerance mask It is twice as hard as the standard mask.
Zoom stereo microscope unit 15 to 100 magnifications, Binocular type, Trinocular tyoe (correspond to CCD camera)