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Hitachi High Technologies in America

High-Sensitivity XRF Analyzer EA6000VX

The EA6000VX High-Sensitivity XRF Analyzer is capable of determining hazardous substances over entire surfaces as well as measuring microscopic points in a specified area; tasks that are not possible using conventional XRF instruments.


High-speed Mapping

The high count rate detector (max. 150,000 cps) and the large stage that scans a max. 250 mm × 200 mm area provide high-speed mapping. For example, when mapping a 100 mm × 100 mm area, the EA6000VX can detect and specify the location of lead contained in the terminal of a mounting board in just a few minutes.

High Count Rate Detector with No LN2 Required

Equipped with the world-leading high count rate detector (a count rate 15 times higher compared with conventional models), the EA6000VX greatly improves measurement efficiency. Additionally, the detector does not require LN2, resulting in safer operation and higher up-time.

Continuous multi-point Measurements

With an auto-sampler, up to 500 points can be specified and continuously measured. Thus, measuring large samples can be performed with high throughput and minimal user intervention.

High Precision Overlap Function

The EA6000VX is capable of coating thickness measurements typically performed with the FT series, including the challenging measurement of ultra-thin Au film coatings. Analysis of hazardous substances such as Pb in plating can be determined simultaneously with coating thickness measurement. Some applications include the measurement of hazardous substance concentration in Pb-free solder plating, Sn plating of lead frames, and electroless Ni plating.

Microscopic Area Coating Thickness Measurements

The EA6000VX is capable of coating thickness measurements typical of the FT series including coating thickness measurement of ultra-thin Au films. Analysis of hazardous substances such as Pb in plating can be measured simultaneously with coating thickness measurements. For example, possibilities include composition measurement of hazardous substances in Pb-free solder plating, Sn plating of lead frames, and electroless Ni plating.

RoHS Inspection

Effectively measures RoHS restricted substances contained in resin and metals with high sensitivity. You can specify areas to measure even with on complex sample geometries.

Light Element Measurement

The He Purge option enables the analysis of light elements starting with Na. The system purges with He only while making measurements, providing stable, cost-effective analysis.

See-through Mapping Fuction

Mapping images of various elements, such as Pb on boards, can be obtained without taking apart products or even knowing anything about the internal structure of laptop computers and cell phones, for example. By comparing the element mapping images obtained by penetrating X-rays, a great deal of information can be obtained about the structure and internal components.

Contaminant Analysis

With its high-speed mapping function, the EA6000VX is able to detect and locate small metal contaminants in the tens of micrometers size range for a wide measurement area (at a maximum of 250 mm × 200 mm). Small or minute amount of contaminant contained in organic substances including resin, can be also detected.

Technologically Enhanced Operability -Auto Approach and Sample Collision Prevention Mechanism-

Auto Approach Function measures the sample height and automatically adjusts the distance between sample and detector so that operator can easily measure samples with complicated shapes. In the case of manual operation, Sample Collision Prevention Mechanism prevents sample damages.


Elements Atomic nos. 12 (Mg) to 92 (U)
*Atomic nos. when using helium purge 11 (Na) to 92 (U)
Sample state Solid / Powder / Liquid
X-ray source Air-cooled X-ray tube (W target)
Voltage: 15 kV, 30 kV, 40 kV, 50 kV
Current: 20 to 1000 µA
X-ray direction Top-down Irradiation
Detectors Vortex® (SDD) *No liquid nitrogen required
Analysis area (beam size) Square 0.2 mm, 0.5 mm, 1.2 mm, 3 mm
Electric switching
Sample observation High resolution CCD camera, 2 system
Chamber 580(W) × 450(D) × 150(H) mm
Both point analysis and mapping for entire 250(X) × 200(Y) mm
Filter 6 mode automatic switching
Controller Desktop PC and 19" LCD monitor
Mapping functions Align with sample image, Area integrated spectral display, Quantitative integrated function
Qualitative functions Spectrum measurement, Auto-ID, Comparison display
Quantitative functions Bulk CAL, Bulk FP, Film CAL, Film FP
Data Process Microsoft Excel, Microsoft Word
Safety functions Door interlock, Crash protection, Instrument seld-diagnosis
Power requirements
(Electric box included)
AC100 V to 240 V ±10%, 750 VA max.


  • Helium Purge
  • Joystick Controller
  • Signal Tower
  • Dual Monitor
  • Sample Holder
  • Sample Setting Film
  • Printer
  • HSEASY (Precision control software)
  • * "Microsoft", "Excel" and "Word" are registered trademarks of Microsoft Corporation in the United States and other countries.
  • * Vortex is a registered trademark of Hitachi High-Technologies Science America, Inc. in the United States and a registered trademark of Hitachi High-Tech Science Corporation in Japan.