In 1981, the company started service business for EB equipment manufactured at Naka Works, Hitachi, Ltd. In August 1984, the Semiconductor Equipment Dept. was established to expand delivery of semiconductor manufacturing and evaluation equipment. In October 2001, the etching equipment at Hitachi's Kasado Plant and the ion beam application equipment (IB) at the Kokubu Works (now Hitachi Ibaraki Technical Services) were integrated into Hitachi High-Technologies (now Hitachi High-Tech).. In December of the same year, the etching equipment and IB service businesses of Hitachi Industries were integrated into our company and launched as Semiconductor Equipment Dept. 2. The existing Semiconductor Equipment Dept. was renamed Semiconductor Equipment Dept. 1.
In April 2002, following the spin-off of Hitachi, Ltd., the company began its Usher (UA) service business. In April 2005, the Semiconductor Equipment Dept. I and II were renamed Semiconductor Manufacturing Equipment Dept. I and II, respectively. In April 2010, the Semiconductor Manufacturing Equipment Dept. I and II were merged into the Semiconductor Manufacturing Equipment Dept. In April 2019, the Semiconductor Manufacturing Equipment Dept. was renamed the Process Equipment Dept. New equipment sales operations for domestic etching equipment were transferred from Hitachi High-Tech, and the Process Equipment Division Product Sales Group was newly established.
In April 2024, the functions of the Kasado Center were integrated into the Process Equipment Department's Refurbish Group. At the same time, it transferred to the SGK building which was run by the Product Support Department of the Process System Product Division, Nanotechnology Solution Business Unit, Hitachi High-Tech.

While the number of equipment in operation in Japan is decreasing, 90% of the equipment in operation is more than 10 years old. We are responding to customer needs by maintaining a service provision system in terms of resources, technology, and parts.
Demand for new and reused equipment has been increasing along with the rise in demand for power semiconductors for EVs and other applications since FY2021, and companies are actively investing in SiC and other new devices.
In overseas markets, demand for logic and memory devices is strong due to the Corona disaster in FY2020 and the shift to telework, and in addition to the conventional US, South Korea, and Taiwan, equipment deliveries to companies in China have progressed, so along with the start of mass production, expansion of overseas support is required.

The company specializes in the delivery and installation of pedestals, chillers, and other peripheral equipment for exposure systems of various companies, as well as preventive maintenance services for some auxiliary equipment.

The services were mainly performed under maintenance contracts, but with the convergence of the businesses, the domestic service business was converged from March 2019 to March 2021.

Semiconductor companies continue to invest in the production of new devices. The number of equipment in operation in Japan is expected to increase due to repeat orders for conventional equipment, the horizontal deployment of SiC-compatible equipment, and the launch of semiconductor mass-production plants.
In addition to promoting preventive maintenance, which is a core business, the company will work with the Customer Success Department, which was established within the Nanotechnology Service Division in April 2024, to strengthen its efforts to eliminate PS accidents and to respond to the discontinuation of production, which are necessary to maintain operation.
Furthermore, in order to replace older equipment, we will collaborate with the Process System Product Division of the Nanotechnology Solution Business Headquarters of Hitachi High-Tech to develop new small-diameter equipment and participate in demonstration evaluations to help bring it to market at an early date.