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In manufacturing, a "clean" approach is vital to achieving high quality, high throughput, high yield and reducing manufacturing waste.
In the world, the Internet, communication, and information processing are developing more and more, and various precision devices such as semiconductors and manufacturing systems are becoming more sophisticated and more precise.
The higher the precision required, the more vital it is that cleanliness be included as part of the basic manufacturing technology and know-how in order to ensure production quality.
The "clean" approach is a very important activity to increase the corporate value of customers.
[Exclude foreign matter and pollution]
We have vast manufacturing experience with semiconductor manufacturing equipment and precision analysis/scientific instruments for which advanced clean technology is essential.
[Analysis of foreign matter and contamination]
Many of our customers use our electron microscope, various analyzers, and foreign matter inspection equipment.
[Remove foreign matter and contamination]
We have been providing our customers with a cleaning system that uses wet, dry cleaning technology and environmental control technology.
In addition to the cleanliness efforts we have made so far, we will also integrate digital technologies with alliance partners that utilize our trading functions.
Hitachi High-Tech is able to propose solutions for solving clean issues from various perspectives.
Although it is very important to accumulate know-how in-house, you don't have to establish everything yourself.
Responding to market demands in a timely manner and competitive costs will strengthen your business.
Hitachi High-Tech's clean solution is to solve the problems caused by foreign substances together with the customer.
Our goal is to provide a solution that solves the problem of foreign matter that customers are having troubles by using dry cleaning technology, which has a low environmental impact, as a core solution.
I. Target parts
II. Conventional method
→ Quality issues due to adhesion of organic substances and foreign substances inside the camera.
IV. Automation （example）
Precision surface treatment technology using plasma continues to evolve.
CCP: Capacitively Coupled Plasma
ICP: Inductively Coupled Plasma
|Use case||Plasma type||Process||Effects||Application|
|Desmear||Vacuum||After drilling.||Removal of smear||Flexible board, rigid board
(Removal of smear in micro vias of 20 to 100umφ)
Before resign sealing.
Before lamination and painting.
LCP: Liquid Crystal Polymer
Atmospheric pressure Plasma (remote type)
Atmospheric pressure Plasma (Arc jet type)
Vacuum plasma ABF material (CF4+O2 gas)
Vacuum plasma Finger print sensor Descum (CF4+O2 gas)
Atmospheric pressure plasma (with CDA)