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With its exceptional overall performance and user-friendly design, the DMA7100 is ideal for uses from routine and high-level research. A navigation guide in the software and the intuitive sample clamping design allow for simple operation.
The Simple Measurement Wizard in the TA7000 software provides step-by-step navigation from setting measurement conditions to the start of a measurement. The operation procedure is shown with easy-to-understand illustrations which help in setting up suitable measurement conditions and starting a measurement without mistakes.
The new measurement head is designed ergonomically to allow easy operation and reliable sample loading.
Simple Measurement Navigation
The instrument comes standard with a Lissajous monitor for observing the relation between stress and strain of a sample being measured. The deformed state of the sample can be verified both in real time and after measurement for each measurement point. This gives users the information about each measurement’s validity, thus helping to ensure reliable measurements.
With the LN2 Cooling Unit option, a sample can be cooled down to -150°C. It is fully controlled by the TA7000 PC station according to the programmed temperature. This unit achieves highly efficient use of liquid nitrogen, consuming up to 30% less than our previous model.
The Real View DMA system allows sample observation with the camera during measurement. Visible changes in sample properties such as color and shape can be observed in real time and replayed after the measurement. The acquired images complement the DMA data, making measurements more reliable.
|Deformation Mode||Tension, Bending, Shear, Film Shear, Compression, 3-Point Bending|
|Frequency||Sine Wave Oscillation ... 0.01 to 200Hz|
|Measurement Range||105 to 1012Pa(Tension), 105 to 1012Pa(Dual-Cantilever Bending), 103 to 109Pa(Shear),
104 to 1010Pa(Film Shear), 105 to 109Pa(Compression),
106.5 to 1013.5Pa(3-Point Bending)
|Program Temp Range||-150 to 600°C|
|Heating Rate||0.01 to 20°C/min|
|Output Values||Temperature, Frequency, Time, E’(G’), E”(G”),│ E*│(│G*│), tanδ, η, J’, J”, Ft, dL, Stress, Strain|
References and presentation documents regarding thermal analysis and viscoelasticity.
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Timeline of HITACHI Thermal Analysis Products.