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Hitachi

Hitachi High-Tech GLOBAL

Clean Solution System

Concept

1. Importance of cleanliness

In manufacturing, a "clean" approach is vital to achieving high quality, high throughput, high yield and reducing manufacturing waste.

In the world, the Internet, communication, and information processing are developing more and more, and various precision devices such as semiconductors and manufacturing systems are becoming more sophisticated and more precise.

The higher the precision required, the more vital it is that cleanliness be included as part of the basic manufacturing technology and know-how in order to ensure production quality.

The "clean" approach is a very important activity to increase the corporate value of customers.

2. Hitachi High-Tech Clean Solution

[Exclude foreign matter and pollution]
We have vast manufacturing experience with semiconductor manufacturing equipment and precision analysis/scientific instruments for which advanced clean technology is essential.

[Analysis of foreign matter and contamination]
Many of our customers use our electron microscope, various analyzers, and foreign matter inspection equipment.

[Remove foreign matter and contamination]
We have been providing our customers with a cleaning system that uses wet, dry cleaning technology and environmental control technology.

In addition to the cleanliness efforts we have made so far, we will also integrate digital technologies with alliance partners that utilize our trading functions.

Hitachi High-Tech is able to propose solutions for solving clean issues from various perspectives.

3. Creating Value through Customer Collaboration

Although it is very important to accumulate know-how in-house, you don't have to establish everything yourself.

Responding to market demands in a timely manner and competitive costs will strengthen your business.

Hitachi High-Tech's clean solution is to solve the problems caused by foreign substances together with the customer.

Image: Realization of high quality and high yield through comprehensive technology

Solutions to meet your cleanliness needs

Image: Solutions to meet your cleanliness needs

Dry cleaning technology

Science of Cleanliness - CleanLogix Technology

Our goal is to provide a solution that solves the problem of foreign matter that customers are having troubles by using dry cleaning technology, which has a low environmental impact, as a core solution.

Problems with conventional cleaning methods

Our proposal

Adaptable process

  • Remove particles
  • Removal of organic foreign substances and residues
  • Surface modification
  • Removal of release agent

Target field

  • Electronics components
  • Semiconductors
  • Ultra precision machine
  • Optical components
  • Automobile
  • Medical equipment
  • Food and beverage equipment
  • Painting
  • Mold molding

Example of cleanliness in CMOS camera assembly process

I. Target parts

II. Conventional method

  1. Removal of organic substances and adhering foreign substances by cleaning individual parts
  2. Eliminates foreign substances during assembly by air blow.

→ Quality issues due to adhesion of organic substances and foreign substances inside the camera.

III. Measures

IV. Automation (example)

Fine particle CO2 cleaner

Science of Cleanliness - CleanLogix Technology

Fine particle CO2 cleaner CL-JETSeries

Cleaning mechanism

Cleaning mechanism

  1. Discharge generated CO2 particles with assist gas.
    (Assist gas: clean dry air or N2)
  2. When CO2 particles collide with the target object, the liquefied CO2 enters under the foreign matter and separates the foreign matter from the surface (physical cleaning) and dissolves the organic matter (chemical cleaning).
  3. Removes foreign and organic matter when CO2 vaporizes.

Cleaning examples

Oily ink

Before cleaning
Before cleaning

After cleaning
After cleaning

Lens (fingerprint, oily ink)

Before cleaning
Before cleaning

After cleaning
After cleaning

Pixel part of CMOS sensor (organic matter)

Before cleaning
Before cleaning

After cleaning
After cleaning

Features

CO2 particle size control technology produces optimal particles. (0.5~500μm)

  • CO2 particles are sprayed on the target together with an assist gas such as clean dry air.
  • No dew condensation occurs due to heating of assist gas, and low-damage cleaning with fine particles is possible.
  • High cleaning power and low CO2 consumption are realized by the special nozzle structure.
  • Compared to water and solvent cleaning, it is an environment-friendly cleaning.
    (CO2 is a recycled product that is discarded.)

Main patents

US7225819B2/US6656017B2/US6802961B2/US7601112B2/US7901540B2/US8021489B2/US5725154A/US7451941B2/US9381574B1/US9352355B1/ US9387511B1/US8197603B2/US6979362B2/TWI577452B

Equipment appearance

装置外観の写真

Applied technology

Plasma composite technology

Image: Plasma composite technology

Plasma cleaning

Science of Cleanliness - CleanLogix Technology

Precision surface treatment technology using plasma continues to evolve.

Main reactions that can be expected for plasma processing

Table: Main reactions that can be expected for plasma processing

Features

  1. Enables cleaning of fine patterns that cannot be processed by wet processing.
  2. Highly uniform and high density plasma can be generated by our unique ICP technology.
  3. A wide variety of plasma sources can be used for multiple purposes.
    (ICP, CCP, microwave, atmospheric pressure)

CCP: Capacitively Coupled Plasma
ICP: Inductively Coupled Plasma

Plasma equipment -applications and effects -

Plasma equipment -applications and effects -
Use casePlasma typeProcessEffectsApplication
Desmear Vacuum After drilling. Removal of smear Flexible board, rigid board
(Removal of smear in micro vias of 20 to 100umφ)
Cleaning Vacuum/
Atmospheric pressure
Before bonding.
Before resign sealing.
Improve
  • adhesiveness
  • wettability
  • IC, LED, LCD, etc.
    *Before coating, painting.
  • New material for 5G such as LCP, PFA, PTFE, etc.
    *Before laminating the board.
  • Shortening of heat desorption gas treatment time for vacuum parts.
Surface modification Vacuum/
Atmospheric pressure
Before plating.
Before lamination and painting.
Improve adhesion
  • Flexible board, rigid board
  • LCD glass, OLED-ITO glass
  • Smear, which is reaction product, generated when processing micro vias of 20 to 100 μmφ can be removed.
  • Improves adhesiveness by applying to pre-laminating and pre-adhesive
    processing of new material substrates compatible with 5G such as "LCP", "PFA" and "PTFE".
  • Reduction of processing time for degassing vacuum parts performing thermal desorption.

LCP: Liquid Crystal Polymer
PFA: PerFluoroAlkoxy
PTFE: PolyTetraFluoroEthylene

Equipment lineup

Image: Vacuum plasma
Vacuum plasma

Image: Vacuum cleaner
Vacuum cleaner

Image: Atmospheric pressure Plasma (remote type)
Atmospheric pressure Plasma (remote type)

Image: Atmospheric pressure Plasma (Arc jet type)
Atmospheric pressure Plasma (Arc jet type)

Application example

<Example of Organic matter removal>

Vacuum plasma ABF material (CF4+O2 gas)

Image: Before cleaning
Before cleaning

Image: After cleaning
After cleaning

Vacuum plasma Finger print sensor Descum (CF4+O2 gas)

Image 1

Image 2

<Example of surface modification>

Atmospheric pressure plasma (with CDA)

Image: Atmospheric pressure plasma (with CDA)

Click Analysis and Inspection technology!

Click Dry cleaning technology!

Environmental technology! (in preparation)