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Hitachi

Hitachi High-Technologies GLOBAL

  • Recently data speed is further urged by digital coherent innovation. NGK-ED's multilayer ceramic gives a solution,with back-up of simulation technology.
  • Excellent electric characteristics (S-parameter).
  • In addition to transmission and receiver purpose, driver application packages can be provided.

Line up

Back-In Line Package for CFP4

  • High frequency circuit can be routed in 6.3mm package width.
  • With no Kovar lead design is available with fine pitch circuit.
  • Window selection : Lens or Borosilicate glass.
  • Base Material Selection: Cu-W or Cu-Mo with multiple composition.

Coherent Receiver Package

  • Ceramic WALL type and Metal Frame type can be complied.
  • High Power Frequency Connector or Thin-film Substrate equipping can be discussed.
  • Window selection : Lens or Borosilicate glass.
  • Ni-Au Plating finishing(Ni-Pd-Au can be applied for cost reduction).