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Hitachi High-Technologies GLOBAL

E-600/8000 Series

Next generation memories such as FeRAM (Ferroelectric Random Access Memory), ReRAM (Resistance Random Access Memory) and MRAM (Magnetoresistive Random Access Memory) require etching of novel non-volatile materials.
However, by-product adhesion inside of etch chamber causes significant productivity loss in volume production.
Non-Volatile Materials Etch System E-600/8000 Series: the EMCP (Electro Magnetically Coupled Plasma) offers an outstanding solution to this problem ensuring constant high performance even for non-volatile material etch.


Applicable wafer diameter 200mm, 300mm
System configuration 2 etch+ 2 ash (max.)
These photographs are partially different from actual systems.

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