Hitachi High-Tech "Semiconductor Room"
2) Measurement of wiring width after the etching process
(AEI: After Etch Inspection)

The photoresist pattern is used as a mask to form wiring, etc. by etching. After the etching process, the unwanted photoresist is removed (peeled off) by ashing using ozone and plasma.
The dimensions are then measured by CD-SEM.

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