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Solder is typical of samples that contain Pb. We can obtain accurate results by the Thin Film FP method. However, when it comes to measuring plating wire lead samples, accurate results may be difficult if the irradiation area is small. The following is test data using the SEA1200VX.
The Film FP is a useful method for measuring plating samples such as solder. The accuracy of measuring plating wire lead samples can be improved by placing many samples in a row, completely covering the irradiation area. However, SEA1200VX achieves similar results by measuring only one sample or two samples together by using the correction function that takes advantage of scattered X-rays.
Sn Plating lead wire with the thickness of 10.7µm
Thin Film FP with Shape Correction
|Sn Plating Thickness (µm)||Pb Conc (wt%)|
|One String||Set Lengthwise||11.61||0.0421|
|Two Strings||Set Lengthwise||11.45||0.0318|
|Cover Beam Size||Set Lengthwise||11.26||0.0317|
Cover Beam Size