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Hitachi

Hitachi High-Technologies GLOBAL

The EA6000VX also measures coating thicknesses typical of the SFT series applications. Application possibilities include ultra-thin Au coating measurement, also Pb (lead) hazardous substance analysis and simultaneous measurement of that coating thickness. For example, composition measurement of hazardous substances in Pb-free solder coatings, Sn coatings on lead frames, and electroless Ni coatings.

Analysis of Sn-Ag/Cu
Area: 1.2mm square
Film FP method Time: 100 sec (Pb filter), 30 sec (no filter)

Thick Comp ratio Haz Sub
Sn-Ag [µm] Ag [wt%] Pb [ppm]
1 5.34 2.83 291
2 5.30 2.63 297
3 5.31 2.64 347
4 5.34 2.73 303
5 5.31 2.67 329
6 5.33 2.67 334
7 5.33 2.75 291
8 5.30 2.74 262
9 5.35 2.72 303
10 5.36 2.91 308
AVE. 5.33 2.73 306.5
SD 0.02 0.09 24.6
CV 0.4% 3.2% 8.0%

Au/Ni/Cu coating thickness
Area: 0.2mm square
Cal method
Time: 30 seconds

Au [µm] Nl [µm]
1 0.054 5.11
2 0.055 5.11
3 0.054 5.12
4 0.055 5.08
5 0.054 5.10
6 0.055 5.13
7 0.053 5.08
8 0.053 5.09
9 0.054 5.08
10 0.055 5.14
AVE. 0.054 5.14
SD 0.008 0.02
CV 1.5% 0.4%