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Throughout human history, materials have played a critical role in the development of civilization, and materials science impacts everything from everyday household items to space applications. Since the invention of electron microscopy and scanning probe microscopy, these techniques have made important contributions to the field of materials science, since they allow the morphology, composition, physical properties, and dynamic behavior of materials to be evaluated. They are indispensable for product quality control and the development of new materials. Hitachi High-Technologies offers a diverse product line-up, including tabletop SEM systems that allow quick user-friendly operation, FE-SEM and TEM systems for performing precise detailed analysis, FIB-SEM systems that are capable of three-dimensional analysis, and AFM systems that allow the simultaneous measurements of surface topography.
SU9000 is the top-of-the-line SEM equipped with cold FE electron source and in-lens objective lens with least aberration, and achieves the world's highest SE resolution of 0.4nm. In addition to high resolution STEM with 0.34nm resolution, EELS and diffraction that are usually considered difficult for SEM can also be supported.
SU5000 combines Schottky emission electron source and out-lens objective lens for high resolution imaging and diverse analyses of samples with various sizes and compositions. Its drawer type stage allows applications with special stages such as heating, tensile, and so on. Unique user interface, EM Wizard supports best SEM experience of every user.
SU3500 employs thermionic electron source and accommodates a sample with maximum diameter of 200mm or maximum height of 80mm. Low vacuum mode allows rapid observation of insufficiently conductive samples without metal coating to prevent charging. Improved resolution at low accelerating voltage and optional Ultra Variable pressure Detector (UVD) enhance surface imaging capability of samples.
FlexSEM 1000 employs thermionic electron source and achieves resolution of 4.0nm with its compact design ready for desktop setup. Low vacuum mode allows rapid observation of insufficiently conductive samples without metal coating to prevent charging. Optional Ultra Variable pressure Detector (UVD) enhance surface imaging capability of samples under low vacuum environment.
Hitachi's unique 200 kV aberration-corrected TEM/STEM: the perfect harmony of imaging resolution and analytical performance
0.078 nm spatial resolution in STEM is achieved together with high specimen-tilt capability and large solid angle EDX detector(s), all in a single objective lens configuration.
The HF5000 builds on features from Hitachi HD-2700 dedicated STEM including Hitachi's own fully automated aberration corrector, symmetrical dual SDD EDX and Cs-corrected SE imaging. It also incorporates the advanced TEM/STEM technologies developed in the HF series.
Integrating these accumulated technologies into a new 200 kV TEM/STEM platform results in an instrument with an optimum combination of sub-Å imaging and analysis, as well as the flexibility and unique capabilities to address the most advanced studies.
HT7800 series are 120kV digital TEM with enhanced operability. High-resolution screen camera and Image Navigation function ensure comfortable digital operation in a lighted environment. HT7800 offers wide-area, high-contrast imaging while HT7830 realizes best-in-class resolution.
HF-3300 is Hitachi's high-end FE-TEM employing high-brightness cold FE electron source and high accelerating voltage of 300kV to allow both ultrahigh resolution imaging and high-sensitivity analysis. Simultaneous STEM and SEM imaging enables observation of internal structure together with surface topography.
SEM column and FIB column are orthogonally arranged to optimize column layout for 3D structural analysis. FE electron source and its unique detection geometry enable high resolution SEM imaging at beam coincident point. 3D-EDS and 3D-EBSD can be performed without moving the stage. Employing micro-sampling and triple beam system, high quality samples can be prepared for TEM and atom probe.
NX2000 was developed towards the ultimate TEM sample preparation system. FE electron source and high-sensitivity detection system allow high-contrast, real-time end point detection. Sample orientation control technology and Ar/Xe triple beam system enable significant reduction of artefacts and damage during sample preparation. With auto micro-sampling function, the throughput of TEM sample preparation can be drastically improved.
The Hitachi Ethos FIB-SEM incorporates the latest-generation FE-SEM with superb beam brightness and stability. Ethos delivers high-resolution imaging at low voltages combined with ion optics for nanoscale precision processing.
The Hitachi research-grade AFM5300E offers significantly improved sensitivity, accuracy, and resolution of electromagnetic property measurements operated under high-vacuum conditions. Furthermore, it establishes a benchmark for comprehensive environmental control and is the only tool on the market affording AFM imaging in air/liquid/vacuum, a broad temperature range (-120 °C to 800 °C), magnetic field or humidity controls, as well as correlated AFM/SEM/ion milling investigations.
The AFM5500M is a SPM platform equipped with a fully addressable 4-inch stage, optimized for medium-sized samples.
ArBlade 5000 supports both cross-section milling and flat milling to prepare samples depending on the purpose. Cross section width can be expanded to 8mm for applications requiring wide area milling such as electric components.
IM4000Plus supports both cross-section milling and flat milling to prepare samples depending on the purpose. Cooling unit is available for samples susceptible to deformation or melting during heat generating processing. Air protection holder prevents air exposure of reactive samples during sample transfer
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