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© Kouichi Kurosawa, Takehiko Konno, Tsuyoshi Morimoto, Shunya Watanabe, Shoji Kamimura(Hitachi Science Systems, Ltd.)
What of yours handle like? This is a new pattern this year. The true character of this picture is the arrangement of the tungsten plug after the CMP (Chemical and Mechanical Polishing) processing which is the important technology of realizing high-density multilayer wiring of a semiconductor device. This SEM image is produced by mixing a secondary electronic signal (Surface information) and backscattered electronic signal (Composition information). Don't you wear the tradition beauty which hi-technology produced, either?
At 58th photo contest hosted by the Japanese Society of Electron Microscopy in 2002.