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Tabletop MicroscopeHitachi High-Technologies GLOBAL

Au bonding wire

Image of Au bonding wire

TM3030/TM3030Plus can be used to check the surface of specimen after milling. Furthermore it is possible to transfer the specimen stub of IM4000 directly to the TM3030/TM3030Plus.
The 5 kV accelerating voltage having both shape and composition information of the surface clearly demonstrates the crystal contrast due to composition difference.
TM3030/TM3030Plus can quickly make the observation at low vacuum in a few minutes and the resin-embedded samples can be observed without sample preparation because it is equipped with a high sensitive backscattered electron detector. The data is Au bonding wire which is treated by the ion milling.
BSE images at 5kV enable to identify only the composition contrast but also the contrast of crystals.

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