Ion Milling Processing System

Original Diffusion beam allows larger area processing with small diameter electrodes
Six φ100mm wafers can be processed at the same time

Diffusion Ion-Beam

Newly developted diffusion ion-beam allows larger area processing with smaller diameter electrodes
Six φ100mm wafers can be processed at the same time by 6 stages
Good In-Plane uniformity is achieved by a rotary wafer chuck holder

Stand-alone type of model speciallized for Research and Develope
Compact design that equipped electrical equipment and power supplies and etc.
Various sized wafers
* Please consult with us about the size of work specification
Board cooling, board potential neutralization, borad rotating and stage tilting are functioned

Physical etching: Ar Beam allows processing regardless of material reactivity (e.g. PZT, LN, LT, NiFe, Au, composite materials, multilayer film, etc.)
Working temperature: Superior cooling mechanism suppresses material loss of piezoelectric characteristics, crystal structure changes, expansion and PR changes
Charge suppression: Unique neutralization mechanisms reduce material charge during processing
Selectivity: Stabel, highly uniform etching and end-pint detector allows [JUST Etching]
Processing shape: Beam incidence angle, beam divergence angle control function allows to adjust the taper angle
In-Plane distribution: excellent in-plane uniformity, in-plane and outer-surface rate are controlled
Equipment specifications: Diverse line-up of equipment, from small to large diameter and leaf to batch type, etc.

Examples of LT Board Trenching

Physical etching: Ar Beam allows processing regardless of material reactivity (e.g. PZT, LN, LT, NiFe, Au, composite materials, multilayer film, etc.)
Working temperature: Superior cooling mechanism suppresses material loss of piezoelectric characteristics, crystal structure changes, expansion and PR changes
Charge suppression: Unique neutralization mechanisms reduce material charge during processing
Selectivity: Stabel, highly uniform etching and end-pint detector allows [JUST Etching]
Processing shape: Beam incidence angle, beam divergence angle control function allows to adjust the taper angle
In-Plane distribution: excellent in-plane uniformity, in-plane and outer-surface rate are controlled
Equipment specifications: Diverse line-up of equipment, from small to large diameter and leaf to batch type, etc.

Examples of LT Board Trenching