- In-line plasma cleaning process
- High-speed plasma cleaning : 28~33 sec/cycle including loading, plasma treatment and unloading
- Chamber capability : 2~3 strips or 5~6 strips of substrates or lead-frames in one cycle
- Operation mode: Manual or Auto mode
- Multiple processing gases(Ar, O2, H2, Mixed gas etc.) capable of achieving the best surface cleaning and treatment
- Physical, Chemical or Physical/Chemical
Wafer cleaning, Flip-chip, various kinds of BGA, process before Die-bonding, Wire-bonding, Molding in IC packaging or LED packaging etc.