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Hitachi Group
Products & Services

Hitachi Group
Corporate Information

Manufacturing Equipment

Laser Process for Functional Film
Laser Process for Display/PCB
Laser Process for Glass
Thermal Process
Cleaning System
Ion Milling System
Printing/Mounting/Laminating
Environmental Process
Analysis/Inspection Systems

Laser Process for Functional Film

R2R Laser Patterning System for Film

High Performance R2R Laser patterning
Laser LD pumped YV04 laser mounted
355nm/532nm/1064nm Wavelength or CO2
Various patterning for Touch Panel, Solar cell, Functional film etc.

Laser Boring/ID marking System for film

High speed scanning with galvano scanner
Various patterning, marking for ITO, metal/organic film, general resin etc.
355nm/532nm/1064nm Wavelength

Laser Cutting System for film

Laser cutting for POL, PET, TAK, COP, ITO/non-ITO film etc.
High processing quality ~ Crackless, Meltless, Taperless

Laser Knurling System for film

High speed Knurling with galvano scanner
Exclusively accurate machining position
Knurling/Half-cut/Drilling for film, resin etc.

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Laser Process for Display/PCB

Laser Cutting System for OLED film

Field proven exclusively high cutting quality
Laser cutting for PI, PET, POL, Multi-layered film etc.

Laser Marking System for PCB/Display

Fully automated solution system
High quality beam mode and stable output power
Laser marking for PCB/Display etc.

Laser Drilling System for PCB

CO2/UV Laser drilling with R2R system
Laser drilling specialized for PCB

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Laser Process for Glass

Laser Cutting System for Glass

Experienced of PI for OLED, Sodalime, Gorilla, Borosillicate, AF32, Saphire, Metal plate etc.
High-Speed processing with 2 stages, 2 laser heads installed

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Thermal Process

Green Laser Annealing

High quality polysilicon formed by individual laser
Using original Line-beam to perform annealing on OLED, LCD-TFT substrate, Semiconductor wafer process

Photonic Curing Equipment

Momentarily heat the surface only to high temperature without damaging substrate(annealing)
Multi-function Curing ~
Improve conductivity / improve adhesion / quick dry / reduce resistance / soldering

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Cleaning System

In-line Plasma Cleaner

High-speed/Low temperature plasma cleaning
Advanced flow pattern design
High automation and operation friendly design
Extremely high cleaning uniformity/Very little gas consumption

Atmospheric Pressure Plasma Processing System

Effective for organic matter removal, surface modification and surface roughening of film and glass substrates
Suitable for processing finer than corona discharge
Corresponds to R2R system
3 different type of method ~ Direct method / Remote method / Arc Jet method

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Ion Milling System

Ion Milling System

Original Diffusion beam allows larger area processing with small diameter electrodes
Six φ100mm wafers can be processed at the same time

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Printing/Mounting/Laminating

R2R Rotary Screen Printing System

High-speed printing with cylindrical roll
From fine print to continuous printing
Excellent reproducibility from fine patterns to thick film printing

R2R Type Laminator

Available film size up to 1500mm
R2R system
Uniform pressurization by Roll

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Environmental Process

Clean/Dry air Environmental system

Ultra low dew point dehumidification rotor installed
Supply dew point temperature from -20°C~76°C
Applicable for LiB factory, Clean room etc.

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Analysis/Inspection Systems

Photoemission Yield Spectroscope in Air (PYSA Equipment)

Measure the work function or the ionization potential and the density of states(DOS) by photoemission in the air
High precision measurement for counting photoelectrons one by one
Easy and short measurement time (about 5 mins)

X-ray Inspection Equipment

Captures images with high luminance and high resolution with low power
Independent X-ray source from any conventional X-ray light source
Possible to observe fine foreign matter, voids and resin in resin which could not be seen so far clearly

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