From Transistors to Bumps: Preparing SEM Cross-Sections by Combining Site-specific Cleaving and Broad Ion Beam Milling

• Published in SOLID STATE TECHNOLOGY (www.solid-state.com) in December 2014.

• Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving (HAC) (http://www.latticegear.com) and Broad Ion Beam (BIB) milling (Hitachi IM4000).

• Dec 2014 - SST Issue - From Transistors to Bumps.pdf (PDF format, 510kBytes)

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• IM4000Plus Series Ion-Milling Systems

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