Clean Solution System

Concept

1. Importance of cleanliness

In manufacturing, a "clean" approach is vital to achieving high quality, high throughput, high yield and reducing manufacturing waste.

In the world, the Internet, communication, and information processing are developing more and more, and various precision devices such as semiconductors and manufacturing systems are becoming more sophisticated and more precise.

The higher the precision required, the more vital it is that cleanliness be included as part of the basic manufacturing technology and know-how in order to ensure production quality.

The "clean" approach is a very important activity to increase the corporate value of customers.

2. Hitachi High-Tech Clean Solution

[Exclude foreign matter and pollution]
We have vast manufacturing experience with semiconductor manufacturing equipment and precision analysis/scientific instruments for which advanced clean technology is essential.

[Analysis of foreign matter and contamination]
Many of our customers use our electron microscope, various analyzers, and foreign matter inspection equipment.

[Remove foreign matter and contamination]
We have been providing our customers with a cleaning system that uses wet, dry cleaning technology and environmental control technology.

In addition to the cleanliness efforts we have made so far, we will also integrate digital technologies with alliance partners that utilize our trading functions.

Hitachi High-Tech is able to propose solutions for solving clean issues from various perspectives.

3. Creating Value through Customer Collaboration

Although it is very important to accumulate know-how in-house, you don't have to establish everything yourself.

Responding to market demands in a timely manner and competitive costs will strengthen your business.

Hitachi High-Tech's clean solution is to solve the problems caused by foreign substances together with the customer.

Solutions to meet your cleanliness needs

Dry cleaning technology

Science of Cleanliness - CleanLogix Technology

Our goal is to provide a solution that solves the problem of foreign matter that customers are having troubles by using dry cleaning technology, which has a low environmental impact, as a core solution.

Example of cleanliness in CMOS camera assembly process

III. Measures

IV. Automation （example）

Fine particle CO2 cleaner

Science of Cleanliness - CleanLogix Technology

Cleaning mechanism

Cleaning examples

Oily ink

Lens (fingerprint, oily ink)

Pixel part of CMOS sensor (organic matter)

Features

CO2 particle size control technology produces optimal particles. (0.5～500μm)

• CO2 particles are sprayed on the target together with an assist gas such as clean dry air.
• No dew condensation occurs due to heating of assist gas, and low-damage cleaning with fine particles is possible.
• High cleaning power and low CO2 consumption are realized by the special nozzle structure.
• Compared to water and solvent cleaning, it is an environment-friendly cleaning.
  (CO2 is a recycled product that is discarded.)

Main patents

US7225819B2/US6656017B2/US6802961B2/US7601112B2/US7901540B2/US8021489B2/US5725154A/US7451941B2/US9381574B1/US9352355B1/ US9387511B1/US8197603B2/US6979362B2/TWI577452B

Plasma cleaning

Science of Cleanliness - CleanLogix Technology

Precision surface treatment technology using plasma continues to evolve.

Main reactions that can be expected for plasma processing

Features

1. Enables cleaning of fine patterns that cannot be processed by wet processing.
2. Highly uniform and high density plasma can be generated by our unique ICP technology.
3. A wide variety of plasma sources can be used for multiple purposes.
   (ICP, CCP, microwave, atmospheric pressure)

CCP: Capacitively Coupled Plasma
ICP: Inductively Coupled Plasma

Plasma equipment -applications and effects -

• Smear, which is reaction product, generated when processing micro vias of 20 to 100 μmφ can be removed.
• Improves adhesiveness by applying to pre-laminating and pre-adhesive
  processing of new material substrates compatible with 5G such as "LCP", "PFA" and "PTFE".
• Reduction of processing time for degassing vacuum parts performing thermal desorption.

LCP: Liquid Crystal Polymer
PFA: PerFluoroAlkoxy
PTFE: PolyTetraFluoroEthylene

Equipment lineup

Application example

<Example of Organic matter removal>

Vacuum plasma ABF material (CF4+O2 gas)

Vacuum plasma Finger print sensor Descum (CF4+O2 gas)

<Example of surface modification>

Atmospheric pressure plasma (with CDA)