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Hitachi High-Tech in America


Semiconductor scaling continues to this day at a remarkable rate. Now more than ever, cutting-edge technologies and techniques are being utilized to control device architecture at the atomic level. To this end, electron microscopy has proven to be an indispensable constituent of the industry because it allows for not only ultra-high-resolution imaging with a quick turnaround time, but also application on scales ranging from the package level to the atomic level required for the evaluation of controlled gate structures. Hitachi High-Tech provides the most advanced in-line analysis tools for semiconductor development and manufacturing as well as for failure analysis and quality assurance. Our expansive portfolio includes a wide range of microscopy solutions including ultrahigh-resolution FE-SEM, unique FIB-SEM systems, TEM, traditional SEM, and sample preparation equipment.


Front-end R&D and Failure Analysis

  • Ultra-High-Resolution Schottky Scanning Electron Microscope SU7000SU7000: The Next-Generation FE-SEM
    The modern FE-SEM requires not only high performance but also a multitude of functionalities including wide-area observation, in-situ analysis, variable pressure, high-resolution imaging at low accelerating voltages, and simultaneous multi-signal collection.
    The SU7000 is designed to address these aspects and more by delivering enhanced information for diversified needs in the field of electron microscopy.
    Experience the nano-world with the SU7000!
  • Ultra-high Resolution Scanning Electron Microscope SU9000The Cold Field Emission source is ideal for high-resolution imaging with a small source size and energy spread. Innovative CFE Gun technology contributes the ultimate FE-SEM with superior beam brightness and stability, affording high-resolution imaging and high-quality elemental analysis. Unique object lens design has a capability of EELS and diffraction as well.
  • Field Emission Transmission Electron Microscope HF5000Hitachi's unique 200 kV aberration-corrected TEM/STEM: the perfect harmony of imaging resolution and analytical performance
    0.078 nm spatial resolution in STEM is achieved together with high specimen-tilt capability and large solid angle EDX detector(s), all in a single objective lens configuration.
    The HF5000 builds on features from Hitachi HD-2700 dedicated STEM including Hitachi's own fully automated aberration corrector, symmetrical dual SDD EDX and Cs-corrected SE imaging. It also incorporates the advanced TEM/STEM technologies developed in the HF series.
    Integrating these accumulated technologies into a new 200 kV TEM/STEM platform results in an instrument with an optimum combination of sub-Å imaging and analysis, as well as the flexibility and unique capabilities to address the most advanced studies.

High-precision FIB-SEM with Real-time SEM Observation

  • Hybrid FIB-SEM System NX2000The ultimate TEM sample preparation tool
    Cutting-edge devices for high-function nano-specimen evaluation and analysis, these tools offer functionality that only FIB-SEM hybrid technology can deliver.
    Target structures are becoming more and more minutely detailed, increasing demand for TEM thin-film sample preparation systems that can prepare thinner, specimens free from artifacts.
    Hitachi High-Tech has combined its established high-performance FIB and high-resolution SEM technology with attitude control and Triple Beam®*1 technology (optional) to produce the NX2000 series.
  • Focused Ion and Electron Beam System Ethos NX5000Unsurpassed Performance with Ultimate Flexibility
    The Hitachi Ethos FIB-SEM incorporates the latest-generation FE-SEM with superb beam brightness and stability. Ethos delivers high-resolution imaging at low voltages combined with ion optics for nanoscale precision processing.
  • Real-time 3D Analytical FIB-SEM NX9000FIB-SEM System for True 3D Structural Analysis
    The newly developed FIB-SEM system from Hitachi, the NX9000 incorporates an optimized layout for true high-resolution serial sectioning to tackle the latest demands in 3D structural analysis and for TEM and 3DAP analyses. The NX9000 FIB-SEM system allows the highest precision in material processing for a wide range of areas relating to advanced materials, electronic devices, biological tissues, and a multitude of other applications.
  • Micro-sampling SystemThis device is used for preparing the desired wafer part for analysis with STEM, TEM, etc. by extracting a micro sample with an ion beam in the vacuum chamber of an FIB system.
  • CAD Navigation System NaSFA (Navigation System for Failure Analysis)The CAD Navigation System for Failure Analysis (NASFA) is used to identify the location on the CAD data corresponding to the LSI pattern being observed with a SEM or FIB system. When the coordinates on the CAD data are specified, the sample stage moves to the particular coordinates, displaying the corresponding SEM image (or SIM image for the FIB). The CAD data and SEM image can be overlaid and it is easy to verify the lower-layer line location, significantly improving the efficiency of analysis and repair work.

Sample Preparation and Cleaning

  • Ion Milling System ArBlade 5000The most advanced broad ion beam system for producing exceptionally high-quality cross-section or flat-milling samples for electron microscopy.
  • Ion Milling System IM4000PlusThe IM4000Plus Ion Milling System utilizes a broad, low-energy Ar+ ion beam milling method to produce wider, undistorted cross-section milling or flat milling, without applying mechanical stress to the sample.
  • Sample Cleaner ZONESEMⅡThe ZONESEMⅡ。 Tabletop Sample Cleaner uses UV-based cleaning technology to minimize or eliminate hydrocarbon contamination for electron microscopy imaging.
  • Sample Cleaner ZONETEM ⅡThe innovative ZONETEM II Desktop Sample Cleaner uses UV-based cleaning technology to minimize or eliminate hydrocarbon contamination for electron microscopy imaging. ZONE offers easy-to-use cleaning for pre-analysis sample preparation, ensuring the best possible data from your TEM samples.

Conventional Imaging and Analysis

  • Tabletop Microscope TM4000 II / TM4000Plus IIThe Future of Tabletop Microscopes is Here!
    The TM4000 Series features innovation and cutting-edge technologies which redefine the capabilities of a tabletop microscope. This new generation of the long-standing Hitachi tabletop microscopes (TM) integrates ease of use, optimized imaging, and high-image quality, while maintaining the compact design of the well-established Hitachi TM Series products. Experience the new dimension of tabletop microscopes with the Hitachi TM4000 II and TM4000Plus II.
  • Scanning Electron Microscope FlexSEM 1000 IIThe FlexSEM 1000 II VP-SEM combines innovative technological features with an intuitive interface, to deliver adaptability and flexibility in a powerful, automated, lab-friendly package. Cutting-edge technology and circuitry provides unrivaled imaging performance, even in variable-pressure environments, a feature previously only available in a full-sized SEM. This SEM runs on clean energy for an economical analytical tool, without compromising performance.
    The FlexSEM will change your view of electron microscopy!
  • Scanning Electron Microscope SU3800/SU3900Performance & Power in a Flexible Platform
    Hitachi High-Tech's scanning electron microscopes SU3800/SU3900 deliver both operability and expandability. The operator can automate many operations and efficiently utilize their high performance. The SU3900 is equipped with a large multipurpose specimen chamber to accommodate observation of large samples.

High-resolution TEM / STEM for Composition & Defect Identification

  • Transmission Electron Microscope HT7800 SeriesFrom biomedicine to nanomaterials
    The NEXT Generation of Innovation. Meeting and Exceeding Needs and Requirements in Many Fields.
    The HT7800 RuliTEM is a 120 kV transmission electron microscope (TEM) with multiple lens configurations, including a standard lens for unsurpassed high contrast and a class-leading HR lens for high resolution.
    This breakthrough in advanced innovative design allows for highly efficient workflows and many specialized applications. It represents the cutting-edge solution for modern TEM analyses.
    (Left image: Optional accessories included, the screen shows embedded TEM GUI)
  • Spherical Aberration Corrected STEM/SEM HD-2700The HD-2700 is an 80-200 kV field-emission-gun scanning transmission electron microscope (STEM) with secondary electron (SE) imaging capability. Bulk and surface structures of a specimen can be imaged simultaneously. With the option for a probe-forming aberration corrector, ultra-high resolution can be achieved for both STEM and SE imaging. The Hitachi corrector minimizes the user's effort in doing aberration correction. Large solid-angle EDS* and atomic-spatial-resolution EDS* and EELS spectrum imaging* are enabled.