"Process Plus+Values" The Hitachi High-Technologies Group presents a variety of solutions from the cutting-edge technologies on 300mm wafers to unique applications on 200mm or smaller diameter wafers including new materials such as SiC.
Hitachi High-Technologies Corporation
Hitachi High-Tech Solutions Corporation
Hitachi High-Tech Fielding Corporation
Hitachi High-Tech Fine Systems Corporation
Dec.12(Wed)～14(Fri) 2018
10:00～17:00
Free of charge ,need to registration
SEMI
Venue: East Hall 4
Session1:
Challenges and solutions for process control of next generation patterning technologies with using CD-SEM based Edge Placement Error (EPE) metrologies
Date & Time
・13：40 to 14：30 December 12(Wed)
・12：40 to 13：30 December 14(Fri)
Session2:
"Mirelis" for non-destructive inspection of crystal defects and latent scratches in SiC wafers.
Date & Time
・12：40 to 13：30 December 13(Thur)
Photo : TM4000 Plus
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