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SEMICON JAPAN/APCS 2025

SEMICON JAPAN 2025

Hitachi High-Tech

Hitachi High-Tech supports semiconductor manufacturing from the fundamental aspect of 'knowing' through technologies that "Processing, Observation, Measurement, and Analysis".

Conductor Etch System 9000 Series / 9060 Series,High-Precision Electron Beam Metrology System GT2000,High Voltage CD-SEM CV7300
SEMICON JAPAN 2025 logo

Hitachi High-Tech Corporation
Hitachi High-Tech Fielding Corporation

Date

December 17-19, 2025
10:00am – 5:00pm

Venue

Tokyo Big Sight

Access to Tokyo Big Sight

Organizer

SEMI Japan

Entrance Fee

Exhibition: Free need to register
Seminar : Partially Paid

REGISTER HERE

Hitachi High-Tech Group Booth

Hitachi High-Tech Group Booth

Hall 2：S2133

South Hall　Hall 2：S2133

Floor Map | SEMICON Japan

Exhibitor seminars (Free)

EXHIBITOR'S Teach SPOT

Date

Dec. 18 13:30～14:20

Venue

West Hall2 / West Hall2 Meeting Room (2) Private space (EXHIBITOR'S TechSPOT)

Theme

"Introduction of a new High-Resolution CD Measurement SEM CS5000 for High-Precision CD Measurement"
Hitachi High Tech has developed the CS5000, a successor to the high-resolution CD-SEM CS4800 for a wide range of 4, 6, and 8 inch wafers, featuring new optical modes capable of handling insulator wafers. This seminar will introduce and demonstrate the new CD-SEM CS5000.

EXHIBITORS TechSPOT | SEMICON Japan

Exhibition Products

Processing
Conductor Etch System M-600 Series
Conductor Etch System 9000 Series / 9060 Series
[Special corner]Smart Maintenance demonstration by VR technology
Dry Etching System GAEA-series
Plasma Treatment System NEMST-D2002ILD
Formic Acid Reduction Vacuum Reflow System MPW
Wet Etching System ETS-series, Resist Development & Stripping System ETU-series, Wet Cleaning System ETS-series
FOUP Cleaning and Drying System for Panel NFC-R510
Laser Annealing System LAPOLLON, Laser De-Bonding System WD400U


Observation

Hitachi High Resolution FEB CD Measurement SEM CS5000
Defect Feature Evaluation SEM CT1000
Hitachi Dark Field Wafer Defect Inspection System　DI2800
Mirror Electron Inspection System Mirelis VM1000
Wafer Surface Inspection System LS9600 / Dark Field Wafer Defect Inspection System　DI4600
Defect Review SEM CR7300
Advanced Area Inspection SEM GS1000
Scanning Acoustic Tomography (SAT) WAFER LINE
X-ray Inspection System TUX-8000, MUX-3400/3410, MUX-2021


Measurement

High-Precision Electron Beam Metrology System GT2000
Advanced CD Measurement SEM CG7300
High Voltage CD-SEM CV7300
[Special corner] Welcome to the world of CD-SEM
System Solution of CD-SEM
Offline Recipe Creation system RecipeDirector / Offline Multi-Function Measurement system DesignGauge-Analyzer Plus / Online High-Speed Multi-Parameter Measurement System MI-Boost
X-ray Fluorescence (XRF) Coating Thickness Measurement System FT160
TGV Inspection System 3D NIR Tomography, TSV Inspection System Via Master A300


Analysis


Sustainable Maintenance Support
Semiconductor analysis using TEM/SEM technologies
Ultra-high Resolution Scanning Electron Microscope SU9600
High Resolution FE-SEM SU8600/SU8700
Nano-Prober NP8000
High Resolution Schottky Sccaning Electron Microscope SU3900SE/ SE Plus
Ion Milling System IM4000Ⅱ/ ArBlade 5000


For details, please check Web page of SEMICON Japan 2025.

https://www.semiconjapan.org/en
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