Dry Etch Systems
Introducing the product lineup of dry etch systems
Hitachi High-Tech features EMCP(Electro Magnetically Coupled Plasma) as an unique solution with integrated cleaning technology for non-volatile material etch.
It offers highly productive etch of non-volatile materials used for next generation memories and thin film heads for HDD(Hard Disk Drive).
Hitachi High-Tech's plasma chamber for conductor etch is based on an an ECR(Electron Cyclotron Resonance) plasma source, able to generate a stable high-density plasma at very low pressure ( 0.1 Pa).
Microwave ECR plasma provides a wide process window in both R & D and mass production through accurate plasma parameter management, such as plasma distribution or plasma position control.
The same plasma control technology is also applied to dry cleaning to maintain a more stable chamber condition.
Hitachi High-Tech provides the following production support programs with the concept of "achievement of total solution services to enhance the value-added equipment and to reduce operation cost."