Equipped with polycapillary X-ray focusing optics and a silicon drift detector, FT160 enables high preciseness and high throughput in nano-order level coating thickness measurement of electronic parts.
Accomplishing highly precise measurement by irradiate high-luminance primary x-ray to the area of about 30 μmφ.
High count rate silicon drift detector enables highly precise measurement.
Precise multi-point automatic measurement function helps high efficiencies of the measurement.
Daily routine measurements can be conducted easily by using registered application-like recipe.
Adoption of closed housing greatly minimizes the risk of x-ray leakage.
Wide door design improves visibility of the sample and operability of the instrument.
| Model | FT160S | FT160Sh | FT160 | FT160h | FT160L | FT160Lh |
|---|---|---|---|---|---|---|
| X-ray source | Standard | High-energy | Standard | High-energy | Standard | High-energy |
| Mo | W | Mo | W | Mo | W | |
| Elements | Atomic No. 13(Al) to 92(U) | |||||
| Sample stage (mm) | 300(W) × 245(D) | 420(W) × 320(D) | 620(W) × 620(D) | |||
| Maximum sample size (mm) | 300(X) × 245(Y) × 80(Z) | 400(X) × 300(Y) × 100(Z) | 600(X) × 600(Y) × 20(Z) | |||
Introducing measurement examples by film thickness measurement equipment.
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