Laser Machines

By using laser, these machines can form a circuit directly into transparent conductive films, extraction electrodes, etc. in functional films that are used on touch screen panels.
We offer a reduction in manufacturing cost and flexibility through a web process.

Special Features
Examples of processing and implementation
Examples of application

Special Features

High process adaptability by matching with multiple wavelengths

Selectable wavelength from Ultraviolet light 355 nm or visible light 532 nm or near-infrared light 1064 nm
Focusing on development applications, wavelength selection can be tailored according to work absorption

Homogeneous processing by high-speed control of the laser pulse

Stabilization of the pulse energy and pulse interval using constant velocity control
Fast emission through its own fast pulse control

Reduction of thermal effect due to the short pulse width

Emission of pulse with a width of 10 nsec is possible through a compact YVO4 laser. Thermal effect is reduced, and damage to the substrate is controlled

High precision patterning in 200mm x 200mm area

High precision positioning by digital encoder type galvanometer scanner
Optical aberrations due to three-dimensional control is eliminated, and performs well in both large scan areas and small spots

Laser oscillator	Diode pumped Nd：YVO4 Laser
Laser wavelength	1064nm、532nm or 355nmc
Can support work from	50mm x 50mm ～ 300mm x 300mm
Size of equipment	W 1,500mm × L 1,200mm × H 2,300mm
Scanning speed	Max、41000mm/s
Beam profile	Circle or Square

Laser oscillator	Diode pumped Nd：YVO4 Laser Diode pumped Yb：Fiber Laser
Laser wavelength	1064nm、532nm or 355nm
Can support work up to	～G5
Size of equipment	W 4,000mm x L 4,000mm x H 2,400mm
Stage Positioning accuracy	<±30um
Scanning speed	Max、1000mm/s
Number of beam heads	～ 12 Heads