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Hitachi

Hitachi High-Tech GLOBAL

Compact ion beam etching machine

Features

  • Etching rate control is possible high and low
  • Rotating and tilting wafer holder.
  • Plenty of chuck types can be selected.
  • Compact footprint
  • End point detection system (Apply Option With Load Lock).

Main Applications

  • Electronic devices, MEMS manufacturing, microfabrication research, development, prototyping, small volume production applications, etc.
  • Ion irradiation to a small solid object, etc.

Equipment evaluation

We will provide sample processing tailored to the customer's application for free for the first time.
Please make inquires our company regarding wafer size, number of wafer for processing, etc.

Specifications

TypeIM-150
Ion source size Φ150
Ion source voltage 300~1000V
Current density ~1mA/cm2
Object substrate 1 × Φ4"
Holder motion Rotation and inclination
Holder cooling Water cooling/ Gas cooling
Wafer replacement Manual

Load lock is also available.

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