Defect and Pattern Evaluation SEM　CT1000

3D observation capability contributing
“to Shorten development cycle“ and
“to enhance product quality“ of G&C device^*1

Once a wafer of up to 200 mm in size has been transported automatically, CT1000 moves precisely to the critical pattern position, or the defect position detected by the defect inspection unit. Three-dimensional SEM observation can then be performed using a tilting sample stage. CT1000 also has an energy-dispersive X-ray spectrometer (EDS) ^*2 that can be used to infer the elements contained in the sample for observation.

*1）

G&C device is an abbreviation for Green & Communication Device.
Specifically, electronic devices and electronic components　manufactured
on φ100/125/150/200mm wafers.
(Ex: SAW / BAW, MEMS and sensors, power and analog devices, etc.)

*2）

Option

*

Signal tower: Option