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Hitachi High-Tech in India
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Conductor Etch Systems

Introducing the product lineup of conductor etch systems

9000 Series

Conductor Etch System 9000 Series

Next generation devices at 20nm and below require double-patterning, 3D (three-dimensional) structures, and complex, high-precision processes that include protective layer formation and finishing techniques for new materials.

M-8000 Series

Conductor Etch System M-8000 Series

Conductor Etch System M-8000 Series is utilized for hard mask and silicon etching for 32nm and beyond. Hitachi High-Tech developed new process flows, such as double patterning and new material etch processes such as high-k dielectric/metal gate through JDP (Joint Development Program) with device makers and material / tool suppliers.

M-600/6000 Series

Conductor Etch System M-600/6000 Series

Low temperature etch technology and TM (Time Modulation) bias technology together with the ECR (Electron Cyclotron Resonance) high density plasma source provide for a clean process, superior trench profiles without sidewall residue, and excellent productivity.