Realized a wide variety of enhanced and reliable metrology for semiconductor mass production in the EUV Lithography era.
Achieved high reliable process control by minimizing machine differences error down to the atomic size level. (Improved to enhance tool-to-tool matching performance by around 10% compared to the previous model.)
Clear and high-resolution images are realized by improving environmental resistance and anti-charging high-speed scanning.
Applicable to a wide range of metrology needs from high-precision CD to CD Uniformity by improved scanning performance.
Contributes to productivity and CoO (Cost of Owner ship) improvement by increasing throughput and improving Edge Exclusion