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|Company Name||Yamashita Materials Corp.|
|Location||Zama-City , Kanagawa, JAPAN|
|Established||June 15th, 1965|
|Capital||250 Million JPY|
(FY ended 3/31/2019)
|2,520 Million JP
|Number of Employees||137|
Ultrafine Circuit High-Frequency FPC can be used for high-frequency applications above GHz band and bare chip mounting.
Circuit formation by semi-additive process (SAP) using liquid crystal polymer (LCP) with a low dielectric property as a core material enables the formation of 100 Ω differential transmission lines at a wiring pitch of 50 µm or less.
Also, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) is applied on a mounting pad to support wire bonding mounting with bare chips.
The semi-additive process is characterized by high circuit formation accuracy of ±5µm, making it an ideal method for impedance control.
The followings is an example. Please contact us for availability of specifications.
|Number of layers||2|
|Interlayer connection Via||Through-Via（φ0.1mm～）|
|Base material||LCP（Liquid crystal polymer）|
|Covercoat||Low dielectric coverlay、Solder resist|
|Surface treatment||Gold flash plating
|Impedance matching||Differential 100Ω±10%|
Multi-layer flexible board adaptable for fitting card edge connecter with double-sided contant