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Power devices

Fluorescent X-ray (XRF) Coating Thickness Gauge FT110A

PRODUCT

Fluorescent X-ray (XRF) Coating Thickness Gauge FT110A

The FT110A XRF Coating Thickness Gauge has a new auto focus function which automatically focuses on the sample to acquire optical image within a few seconds. No manual adjustment is required, which results in higher throughput.

X-ray (XRF) Coating Thickness Gauge FT160 Series

PRODUCT

X-ray (XRF) Coating Thickness Gauge FT160 Series

Equipped with polycapillary X-ray focusing optics and a silicon drift detector, FT160 enables high preciseness and high throughput in nano-order level coating thickness measurement of electronic parts.

Compact ion beam etching machine

PRODUCT

Compact ion beam etching machine

Product information of Compact ion beam etching machine.

Single wafer type ion beam etching machine

PRODUCT

Single wafer type ion beam etching machine

Product information of Single wafer type ion beam etching machine.

Batch type ion beam etching machine

PRODUCT

Batch type ion beam etching machine

Product information of Batch type ion beam etching machine.

Spin Processor (MSP-1)

PRODUCT

Spin Processor (MSP-1)

This spin processor is suitable for R&D and small production. All processes from chemical process to dryer are in one cup.

Multi Spin Processor (MSP-2)

PRODUCT

Multi Spin Processor (MSP-2)

Multi spin processor is suitable for mass production and Multi complex process.

Processing Machine for MEMS Device

PRODUCT

Processing Machine for MEMS Device

Introduction of Processing Machine for MEMS Device

Power device Evaluation Equipment

PRODUCT

Power device Evaluation Equipment

Introduction of Power device Evaluation Equipment

Batch Type Wet Station

PRODUCT

Batch Type Wet Station

Our system has batch type cleaning ,resist stripping and etching potions. All processes from chemical cleaning to dryer are fully automated.

Scanning Probe Microscopes (SPM/AFM)

PRODUCT

Scanning Probe Microscopes (SPM/AFM)

Introduction of Scanning Probe Microscopes (SPM/AFM)

Electron Microscopes (SEM/TEM/STEM)

PRODUCT

Electron Microscopes (SEM/TEM/STEM)

Introduction of Electron Microscopes (SEM/TEM/STEM)

Focused Ion Beam Systems (FIB/FIB-SEM)

PRODUCT

Focused Ion Beam Systems (FIB/FIB-SEM)

Introduction of Focused Ion Beam Systems (FIB/FIB-SEM)

Sample Preparation

PRODUCT

Sample Preparation

Introduction of Sample Preparation

Field Instruments/Analyzers

PRODUCT

Field Instruments/Analyzers

Introduction of Field Instruments/Analyzers

CD-SEM & Defect Inspection

PRODUCT

CD-SEM & Defect Inspection

Introduction of CD-SEM & Defect Inspection

Conductor Etch System M-600/6000 Series

PRODUCT

Conductor Etch System M-600/6000 Series

Conductor Etch System M-600/6000 Series is targeted for deep silicon trench etch of power devices used in mobile systems, home electrical appliances, automobiles, trains, etc. Low temperature etch technology and TM (Time Modulation) bias technology together with the ECR (Electron Cyclotron Resonance) high density plasma source provide for a clean process, superior trench profiles without sidewall residue, and excellent productivity.

Production Support Program

PRODUCT

Production Support Program

Hitachi High-Tech provides the following production support programs with the concept of "achievement of total solution services to enhance the value-added equipment and to reduce operation cost."

Microwave ECR Plasma Etch Chamber

PRODUCT

Microwave ECR Plasma Etch Chamber

Hitachi High-Tech's plasma chamber for conductor etch is based on an an ECR(Electron Cyclotron Resonance) plasma source, able to generate a stable high-density plasma at very low pressure (< 0.1 Pa). Microwave ECR plasma provides a wide process window in both R & D and mass production through accurate plasma parameter management, such as plasma distribution or plasma position control. The same plasma control technology is also applied to dry cleaning to maintain a more stable chamber condition.