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Power devices
PRODUCT
Fluorescent X-ray (XRF) Coating Thickness Gauge FT110A
The FT110A XRF Coating Thickness Gauge has a new auto focus function which automatically focuses on the sample to acquire optical image within a few seconds. No manual adjustment is required, which results in higher throughput.
PRODUCT
X-ray (XRF) Coating Thickness Gauge FT160 Series
Equipped with polycapillary X-ray focusing optics and a silicon drift detector, FT160 enables high preciseness and high throughput in nano-order level coating thickness measurement of electronic parts.
PRODUCT
Single wafer type ion beam etching machine
Product information of Single wafer type ion beam etching machine.
PRODUCT
Batch type ion beam etching machine
Product information of Batch type ion beam etching machine.
PRODUCT
Spin Processor (MSP-1)
This spin processor is suitable for R&D and small production. All processes from chemical process to dryer are in one cup.
PRODUCT
Multi Spin Processor (MSP-2)
Multi spin processor is suitable for mass production and Multi complex process.
PRODUCT
Batch Type Wet Station
Our system has batch type cleaning ,resist stripping and etching potions. All processes from chemical cleaning to dryer are fully automated.
PRODUCT
Focused Ion Beam Systems (FIB/FIB-SEM)
Introduction of Focused Ion Beam Systems (FIB/FIB-SEM)
PRODUCT
Conductor Etch System M-600/6000 Series
Conductor Etch System M-600/6000 Series is targeted for deep silicon trench etch of power devices used in mobile systems, home electrical appliances, automobiles, trains, etc. Low temperature etch technology and TM (Time Modulation) bias technology together with the ECR (Electron Cyclotron Resonance) high density plasma source provide for a clean process, superior trench profiles without sidewall residue, and excellent productivity.
PRODUCT
Production Support Program
Hitachi High-Tech provides the following production support programs with the concept of "achievement of total solution services to enhance the value-added equipment and to reduce operation cost."
PRODUCT
Microwave ECR Plasma Etch Chamber
Hitachi High-Tech's plasma chamber for conductor etch is based on an an ECR(Electron Cyclotron Resonance) plasma source, able to generate a stable high-density plasma at very low pressure (< 0.1 Pa). Microwave ECR plasma provides a wide process window in both R & D and mass production through accurate plasma parameter management, such as plasma distribution or plasma position control. The same plasma control technology is also applied to dry cleaning to maintain a more stable chamber condition.