Performance & Power in a Flexible Platform
Hitachi High-Tech's scanning electron microscopes SU3800/SU3900 deliver both operability and expandability. The operator can automate many operations and efficiently utilize their high performance. The SU3900 is equipped with a large multipurpose specimen chamber to accommodate observation of large samples.
■Robust Stage for Flexibility in Sample Size, Shape, and Weight
■Increased Viewing Area—SEM MAP Expands the Boundaries of Sample Navigation
■ Automatic Functions for Operators of Any Skill Level
■Multi Zigzag enables wide-area observation across multiple areas.
■High Sensitivity Detectors Supporting All Observation Requirements
■3D Modeling Software: Hitachi map 3D*
■Image Processing, Measurement, and Analysis Software: Image-Pro® for Hitachi
*optional
*optional
Features a graphical user interface offering easy operation and flexibility by:
The Zigzag function enables automatic acquisition of a continuous field of view. The Multi Zigzag function enables zigzag settings at multiple locations on the sample stage, allowing the acquisition of multiple high-magnification images at user-selectable regions of interest. These images can be montaged to create pixel-dense-micrographs by connecting the acquired images with the Viewer function.
*optional
The SU3900 is equipped with a large multipurpose specimen chamber to accommodate observation of large samples.
The newly developed SEM/EDS integration system unifies stage location, condition setting, analysis, reports, and a series of operations from the SEM graphic user interface of the SU3800/SU3900. Controlling everything from the SEM graphic user interface improves throughput and reduces operator tasks.
*optional
The SU3800/SU3900 feature a high-sensitivity UVD. UVD can acquire images and CL information with secondary electron information by detecting the light generated by collisions of secondary electrons and residual gas molecules accelerated by a bias electrode.
With a 5-segment design, it is possible to observe composition images, 3D images, and topographic images from 4 directions without sample rotation. Due to the design and high sensitivity of the detector, high-resolution imaging with improved S/N retention is possible.
Hitachi map 3D automatically combines 4 images acquired from different directions using the backscattered electron detector to construct a 3D model. Measurements such as height between two points, volume, and simple surface roughness (area roughness, line roughness, etc.) are possible. Since all backscattered electron data is collected in a single acquisition, it is not necessary to tilt the sample or adjust the field of view.
The SU3800/SU3900 feature IPI, which transfers SEM images to advanced image-processing software (Image-Pro® manufactured by Media Cybernetics Inc.). The operator can transfer data from SEM images to sophisticated image-analysis software with just one click.
Items | Product Features | ||
---|---|---|---|
SU3800 | SU3900 | ||
Secondary Electron Resolution | 3.0 nm (accelerating voltage 30 kV, WD=5 mm, high vacuum mode) | ||
15.0 nm (accelerating voltage 1 kV, WD=5 mm, high vacuum mode) | |||
Backscattered Electron Resolution | 4.0 nm (accelerating voltage 30 kV, WD=5 mm, low vacuum mode) | ||
Magnification | ×5 to ×300,000 (magnification of image*1) | ||
×7 to ×800,000 (magnification of actual display*2) | |||
Accelerating Voltage | 0.3 kV to 30 kV | ||
Low Vacuum Mode Setting | 6 to 650 Pa | ||
Image Shift | ± 75 µm (WD=10 mm) | ||
Maximum Specimen Size | Φ 200 mm | Φ 300 mm | |
Specimen Stage | X | 0 to 100 mm | 0 to 150 mm |
Y | 0 to 50 mm | 0 to 150 mm | |
Z | 5 to 65 mm | 5 to 85 mm | |
R | 360° in continuous mode | ||
T | -20 to +90° | ||
Maximum Movable Range | Φ 130 mm (in combination with R) | Φ 200 mm (in combination with R) | |
Maximum Movable Height | 80 mm (WD= 10 mm) | 130 mm (WD= 10 mm) | |
Motor Drive | 5-axis motor drive | ||
Electron Optics | Electron-Gun | Pre-centered cartridge type tungsten hairpin filament | |
Objective-Lens Aperture | 4-hole movable aperture | ||
Detectors | Secondary electron detector, sensitive semiconductor backscattered electron detector | ||
WD for EDX analysis | WD=10 mm (T.O.A=35°) | ||
Image Display | Auto-Axis Alignment. Function | Beam control : auto (AFS→ABA→AFC→ABCC) | |
Optical axis adjustment: auto (current alignment) | |||
Beam brightness: auto | |||
Auto Image Adjustment Function | Auto brightness and contrast control (ABCC) | ||
Auto focus control (AFC) | |||
Auto stigma and focus (ASF) | |||
Auto filament saturation (AFS) | |||
Auto beam alignment (ABA) | |||
Auto start (HV-ON→ABCC→AFC) | |||
Operation Auxiliary Function | Raster rotation, dynamic focus, image improvement function, Data input (point-to-point measurement, angle measurement, texts),preset magnification, Stage positioning navigation function (SEM MAP), beam marking function | ||
Optional function | ■Hardware: Track ball, Joystick, Operation panel, Compressor, Ultra sensitive low vacuum detector (UVD), Chamber scope, Camera navigation system ■Software: SEM data manager, External communication interface, 3D-capture, Stage free mode, EDS integration | ||
Options(for External Devices) | Energy dispersive X-ray spectrometry (EDS), Length dispersive X-ray spectrometry (WDS),Various external stages (heating stage, cooling stage, tensile stage) |
*1 : Set magnification with 127 mm x 95 mm (4" x 5" picture size) as display size.
*2 : Set magnification with 509.8 mm x 286.7 mm (1,920 x 1,080 pixels) as display size.