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Focused Ion and Electron Beam System & Triple Beam System NX2000

Focused Ion and Electron Beam System & Triple Beam System NX2000

Toward the ultimate TEM sample preparation system

FIB-SEM systems have become an indispensable tool for characterization and analysis of the latest technologies and high performance nano-scale materials. An ever-increasing demand for ultrathin TEM lamellas without artifacts during FIB processing require the best in ion and electron optics technologies.
Hitachi's NX2000 high performance FIB and high resolution SEM system with its unique sample orientation control* and triple beam* technologies, supports high throughput, and high quality TEM sample preparation for cutting edge applications.
* Option

    Features

    High contrast, real-time SEM end point detection allows ultrathin TEM sample preparation of sub 20 nm devices.





    Real-time SEM monitoring during FIB milling
    Sample: NAND flash memory
    Accelerating voltage: 1 kV
    FOV: 0.6 µm

    Micro sampling* and high precision positioning mechanism* enable sample orientation control for Anti-Curtaining Effects (ACE function) and uniformly-thick lamellas.


    With sample orientation control


    Without sample orientation control

    Triple Beam system* Triple beam configuration for Ga FIB-induced damage reduction.

    EB: Electron Beam
    FIB: Focused Ion Beam
    Ar: Argon ion beam

    Specifications

    FIB column
    Resolution (SIM) 4 nm @ 30kV, 60 nm @ 2kV
    Acceleration voltage 0.5 kV - 30 kV
    Beam current 0.05 pA - 100 nA
    FE-SEM column
    Resolution 2.8 nm @ 5kV, 3.5 nm @ 1kV
    Acceleration voltage 0.5 kV - 30 kV
    Electron source Cold cathode field emission source
    Detector
    Standard detector Upper/Lower SED & BSED
    Stage X: 0 - 205 mm
    Y: 0 - 205 mm
    Z: 0 - 10 mm
    R: 0 - 360° infinite
    T: -5 - 60°

    NANOMESH

    NANOMESH
    The NANOMESH grid for FIB processing alleviates redeposit effects for high quality lamella preparation.
    Numerous locations for mounting lamellae allows for high precision sample preparation and material features for better analysis.

    Special accessories (Optional)

    • Ar/Xe ion 3rd column
    • Micro-sampling System
    • Multi-gas injection system
    • Double tilt system
    • Swing function ( for Ar/Xe ion 3rd column)
    • TEM sample preparation wizard
    • Automatic TEM sample preparation software
    • CAD navigation software
    • Linkage software with defect inspection instruments
    • Air protection holder
    • Cooling holder
    • Plasma cleaner
    • EDS (Energy Dispersive x-ray Spectroscopy) system

    Application Data

    Semiconductor

    3D reconstruction from serial section SEM images

    3D NAND flash memory
    Specimen: 3D NAND flash memory
    (a) Schematic view
    (b) Cross-sectional BSD image (Accelerating voltage : 2 kV)
    (c) 3D reconstructed image (Volume rendering)

     

    Curtain effect free lamella preparation using double tilt system

    3D NAND flash memory
    Specimen: 3D NAND flash memory
    Observation: HF-3300 Cold FE-TEM (Accelerating voltage : 200 kV)

     

    High-precision site-specific lamella preparation

    22 nm FinFET
    Specimen: 22 nm FinFET
    Observation: HF-3300 Cold FE-TEM (Accelerating voltage : 200 kV)

     

    High-quality lamella preparation with in-situ Ar ion milling

    GaN/InGaN
    Specimen: GaN/InGaN
    Final milling: 1 kV Ar
    Observation: HD-2700 Aberration -corrected STEM (Accelerating voltage : 200 kV)

     

    Material Science

    High-quality lamella preparation with in-situ Ar ion milling (1)

    30 kV FIB
    30 kV FIB

    1 kV Ar
    1 kV Ar

    Specimen: Zirconium
    Observation: HF-3300 cold FE-TEM (Accelerating voltage: 300 kV)

     

    High-quality lamella preparation with in-situ Ar ion milling (2)

    30 kV FIB
    30 kV FIB

    1 kV Ar
    1 kV Ar

    Specimen: Aluminium
    Observation: HF-3300 cold FE-TEM (Accelerating voltage: 300 kV)

     

    Applications

    Hitachi FIB Application Data

    Technical magazine
    "SI NEWS"

    This journal addresses a wide range variety of research papers and useful application data using Hitachi science instruments.