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Hitachi High-Tech in Indonesia
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  3. Semiconductor Manufacturing Equipment
  4. Dry Etch Systems

Dry Etch Systems

Introducing the product lineup of dry etch systems

9000 Series

Conductor Etch Systems

Introducing the product lineup of conductor etch systems

In-situ cleaning result

EMCP Etch Chamber

Hitachi High-Tech features EMCP(Electro Magnetically Coupled Plasma) as an unique solution with integrated cleaning technology for non-volatile material etch.
It offers highly productive etch of non-volatile materials used for next generation memories and thin film heads for HDD(Hard Disk Drive).

Microwave ECR Plasma Etch Chamber

Microwave ECR Plasma Etch Chamber

Hitachi High-Tech's plasma chamber for conductor etch is based on an an ECR(Electron Cyclotron Resonance) plasma source, able to generate a stable high-density plasma at very low pressure ( 0.1 Pa).
Microwave ECR plasma provides a wide process window in both R & D and mass production through accurate plasma parameter management, such as plasma distribution or plasma position control.
The same plasma control technology is also applied to dry cleaning to maintain a more stable chamber condition.

Production Support Program

Production Support Program

Hitachi High-Tech provides the following production support programs with the concept of "achievement of total solution services to enhance the value-added equipment and to reduce operation cost."