Inspection Solution

Scanning Acoustic Tomograph / FineSAT III

The Scanning Acoustic Tomograph FineSAT uses ultrasonic waves to obtain images of internal voids, cracks, abrasion, etc., in materials such as semiconductor packages, electronic components, ceramics, metals, resins, in a non-destructive manner.

Dark Field Wafer Defect Inspection System DI2800

Contributes to the detection and management of defects that occur on pattern samples during the manufacturing process of G & C devices.

Dark Field Wafer Defect Inspection System DI4600

Delivering high detection sensitivity and high inspection throughput which enables yield improvement and production cost reduction.

Wafer Surface Inspection System LS Series

Wafer surface inspection system to detect various types of small defects on non-patterned wafer of next generation device.