The ultimate TEM sample preparation tool
Cutting-edge devices for high-function nano-specimen evaluation and analysis, these tools offer functionality that only FIB-SEM hybrid technology can deliver.
Target structures are becoming more and more minutely detailed, increasing demand for TEM thin-film sample preparation systems that can prepare thinner, specimens free from artifacts.
Hitachi High-Tech has combined its established high-performance FIB and high-resolution SEM technology with attitude control and Triple Beam®*1 technology (optional) to produce the NX2000 series.
Example of real-time SEM observation*2 during FIB processing
Sample: NAND flash memory
Acceleration voltage: 1 kV
FOV: 0.6 µm
With attitude control
Normal processing
EB: Electron Beam
FIB: Focused Ion Beam
Ar: Argon ion beam
This patent information is correct as of July 2014. Patent status is subject to change due to adjudication and other factors.
| FIB column | |
|---|---|
| Resolution | 4 nm @ 30kV, 60 nm @ 2kV |
| Acceleration voltage | 0.5 - 30 kV |
| Beam current | 0.05 pA - 100 nA |
| FE-SEM column | |
| Resolution | 2.8 nm @ 5kV, 3.5 nm @ 1kV |
| Acceleration voltage | 0.5 - 30 kV |
| Electron gun | Cold field emission type |
| Detectors | |
| Standard detectors | In-lens SE detector, chamber SE detector, back-scatter electron detector |
| Stages | X: 0 - 205 mm Y: 0 - 205 mm Z: 0 - 10 mm R: 0 - 360° infinite T: -5 - 60° |
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