Real-time 3D analytical FIB-SEM NX9000

FIB-SEM System for True 3D Structural Analysis

The newly developed FIB-SEM system from Hitachi, the NX9000 incorporates an optimized layout for true high-resolution serial sectioning to tackle the latest demands in 3D structural analysis and for TEM and 3DAP analyses. The NX9000 FIB-SEM system allows the highest precision in material processing for a wide range of areas relating to advanced materials, electronic devices, biological tissues, and a multitude of other applications.

Features
Specifications
Application Data

Features

The SEM column and FIB column are orthogonally arranged to optimize the column positioning for 3D structural analysis.
The combination of high-brightness cold-field-emission electron source and high-sensitivity optics support analysis of a wide range of materials from biological tissues to magnetic materials.
The Micro-sampling system and Triple Beam system allow high-quality sample preparation for TEM and atom-probe applications.

Ion milling and observation at normal incidence in real-time for true analytical imaging

The SEM column and FIB column are orthogonally arranged to realize normal incident SEM imaging of FIB cross sections.
Orthogonal column arrangement eliminates aspect deformation, foreshortening of cross-sectional images, and shift of the field of view (FOV) during serial section imaging, which cannot be avoided by conventional FIB-SEM systems. The NX9000 images enable highly accurate 3D structural analysis. Optical correlative microscopy can be applied easily due to the benefit of surface-planar EM imaging.

Conventional FIB-SEM , Orthogonally arranged FIB-SEM

Sample: Mouse brain neuron
Sample courtesy of Yoshiyuki Kubota, Ph.D., Neural Information Processing Systems (NIPS)

Cut & See·3D-EDS^1·3D-EBSD^1 available for a wide variety of materials

Cut&See

Cut & See supports high-resolution, high-contrast imaging of biological tissues, semiconductors, and magnetic materials, such as steel and nickel, at low accelerating voltages.
Serial section images can be collected with high throughput due to the proper geometry of the ion and electron column.

1nm step Cut&See , Serial section images

Sample: NAND flash memory
SEM accelerating voltage: 1 kV
Cutting interval: 1 nm
Number of cut: 300

3D-EDS^*1

Serial section SEM images and serial section elemental maps can be collected using 3D-EDS.
The large-area silicon drift detector reduces the acquisition time and enables elemental mapping at low accelerating voltages.

3D-EDS

Sample: Fuel cell electrode
SEM accelerating voltage: 5 kV
Cutting interval: 100 nm
Number of cut: 212

Sample courtesy of Prof. Naoki Shikazono, University of Tokyo

3D-EBSD^*1

Simultaneous SEM, FIB, and EBSD signals are obtained for 3D-EBSD without moving the stage during FIB sectioning and EBSD analysis. Accuracy and throughput of 3D crystal orientation analysis and segmentation yield high quality and less post-processing correction.

3D-EBSD

Sample: Ni
SEM accelerating voltage: 20 kV
Cutting interval: 150 nm
Number of cut: 150

*1:: Option

Specifications

Specifications
Items		Description
SEM	Electron source	Cold cathode field emission source
	Accelerating voltage	0.1 - 30 kV
	Resolution	2.1 nm@1 kV
	Resolution	1.6 nm@15 kV
FIB	Ion source	Ga liquid metal ion source
	Accelerating voltage	0.5 - 30 kV
	Resolution	4.0 nm@30 kV
	Maximum probe current	100 nA
Standard detector		In-column SED / In-column BSED / Chamber SED
Stage	X	0 - 20 mm ^*2
	Y	0 - 20 mm ^*2
	Z	0 - 20 mm ^*2
	θ	0 - 360° ^*2
	τ	-25 - 45° ^*2
Maximum sample size		6 mm x 6 mm, 2 mm thick

*2：: Stroke is limited by each sample holder

NANOMESH: The NANOMESH grid for FIB processing alleviates redeposit effects for high quality lamella preparation.
Numerous locations for mounting lamellae allows for high precision sample preparation and material features for better analysis.