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The TM3030 features improved electron optics, higher magnification, and built-in image processing to further enhance image quality and resolution at lower accelerating voltage.
The space saving and lightweight design of TM3030 means it can be conveniently installed on a table*. No cooling water is needed, so installation is quick and easy and requires only a standard 100-240 V AC power supply.
Imaging with the TM3030 couldn’t be simpler. Pressing the “Start” button automatically turns on the beam, adjusts focus, brightness and contrast, as well as displays the image at an easy-to-view starting magnification of x100.
When a non-conductive sample is observed with a high-vacuum SEM,electrons accumulate on the specimen surface causing a charge-up phenomenon. Charging prevents imaging. In order to resolve the charge, the sample is usually coated with a thin layer of metal prior to observation. This process is not only time consuming, but also interferes with optical imaging of surface details as well as EDX analysis. The TM3030 overcomes this problem with “charge-up reduction mode.” This mode uses low-vacuum functionality to dissipate the charge.
The 5kV accelerating voltage allows for observation of surface details, it not only offers traditional topographic imaging but also compositional imaging information. The 5 kV observation condition is further enhanced throughout high magnifications by improving the electron optics.
These functions will be utilized to enhance image quality at any observation condition modes and will be very effective for higher magnification specimens.
|Magnification||15 to 60,000×(digital zoom: 2×, 4×)|
|Observation mode||Standard mode
Charge-up reduction mode
|Image mode||COMPO/Shadow 1/Shadow 2/TOPO|
|Sample stage traverse||X: ±17.5 mm, Y: ±17.5 mm|
|Maximum sample size||70 mm in diameter|
|Maximum sample height||50 mm|
|Electron gun||Pre-centered cartridge filament|
|Signal detection system||High-sensitive semiconductor
4-segment BSE detector
|Auto image adjustment function||Auto start, Auto focus, Auto brightness/contrast|
|Frame memory||640 × 480 pixels, 1,280 × 960 pixels|
|Image data memory||HDD of PC and other removal media|
|Image format||BMP, TIFF, JPEG|
|Data display||Micron marker, micron value, date and time, image number and comments, Image mode, Observation condition, D* (Distance), Observation mode|
|Evacuation system (vacuum pump)||Turbomolecular pump: 30 L /s × 1 unit,
Diaphragm pump: 1 m3/h × 1 unit
|Operation help functions||Raster rotation, Magnification preset (two steps)
Image shift (±50 µm@D*=4.5 mm)
|Safety device||Over-current protection function, built-in ELCB|
|OS||Windows® 7 Professional (32/64bit version)|
|CPU||Intel® CoreTM i5-2520M (Equivalent or higher)|
|Memory size||2 GB minimum|
|Display monitor||1,280 × 800 pixels or 1,368× 768 pixels|
|Display size||15-Type display|
|Interface connector||Installing USB2.0 and PC-card slot
(IEEE1394 (6pin) for Oxford EDX is indispensable.)
|Memory device||With HDD DVD-ROM Drive|
|Other||More than 100MB of free space in HDD is required|
|Interface connector||USB 2.0|
|Items||Description(Width × Depth × Height, Weight)|
|Main unit||330 × 606 × 565 mm, 63.0 kg (manual stage)
330 × 630 × 565 mm, 66.0 kg (motor drive stage)
|Diaphragm pump||145 × 256 × 217 mm, 4.5 kg|
|Room temperature||15 to 30°C (Δt=±2.5°C/h or less)|
|Power source (TM3030)||Single-phase AC100 to 240 V
(Minimum: 90 V, Maximum: 250 V)
|Grounding||100 ohm or less|
When a filament is blown, changing the filament is rather easy. Remove the filament from the Wehnelt cap and simply attach a new filament assembly. Since the new filament is pre-centered at our factory, no adjustment is necessary. After attaching the filament assembly to the electron gun, it will be necessary to align the beam according to the on-board instructions for beam alignment.
Pre-centered cartridge filament
Mechanical axis adjustment GUI