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Electron Microscopes use electron beam which has shorter wavelength than light to resolve fine structure considered too small for light microscopes. They are used in a wide variety of fields from metals/ceramics/semiconductors to polymers/biological tissues.
TEM and STEM are used to observe internal structure by detecting electrons transmitted through a thin specimen while SEM is used to observe surface structure by detecting electrons generated upon primary electron beam irradiation on the surface of a sample.
FIB is used to observe surface structure by detecting electrons generated upon ion beam irradiation and process the surface of a sample to an arbitrary shape by the use of focused ion beam. Since the ion beam can arbitrarily scan on a sample, FIB is widely used for site-specific cross section preparation for SEM observation and lamella preparation for TEM observation. FIB-SEM incorporates both FIB and SEM in a single system, and allows in-situ SEM observation of FIB-prepared cross section. By repeating FIB milling and SEM observation, serial cross-sectional SEM images can be collected and reconstructed for further three-dimensional structural analysis of the sample.
Innovative scanning probe microscopy (SPM) products offering extraordinary levels of performance, value, and ease-of-use for a wide range of application from surface topography to a wide variety of nanoscale surface property measurements
Ion milling system to prepare wide cross section of a sample, ion sputter to increase the conductivity of non-conductive sample and sample cleaner to reduce contamination which disturb electron microscope observation.
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